New ProChem Products -Sputtering Targets for Advanced Materials Applications
Sputtering targets are materials used in a process called sputtering, which enables depositing thin films onto various substrates in High-Tech industries such semiconductor, solar, and display technologies.1
To deposit a film, a sputtering target is bombarded by high-energy particles, typically ions, in a low-pressure gas environment. This causes atoms of the target material to be ejected from its surface and deposited onto an appropriate substrate, forming the film of expected thickness and chemical composition.1,2
Usually, choice of the sputtering target material depends on the specific chemical composition and the application of the thin film created.3,4 Materials used as sputtering targets include pure metals, metal alloys, metal oxides, and other compounds of various elements, including gallium, nickel, iron, gold, platinum, palladium, and more.
While ProChem currently offers a set of sputtering targets in the shape of discs (see the table below), other shapes and dimensions can be provided as custom products upon customer’s request.
| Name | Product# | Purity | CAS Number |
| Nickel Oxide Sputtering Target | 2703 | 99%-99.995% | 1313-99-1 |
| Strontium Ruthenate Sputtering Target | 3378 | 99.9% | 12169-14-1 |
| Iron Disulfide Sputtering Target | 2092-1 | 99.9%-99.995% | 12068-85-8 |
| Gallium Oxide Sputtering Target | 1896 | 99.9%-99.99% | 12024-21-4 |
| Gold Sputtering Target | 1935 | 99.9%-99.999% | 7440-57-5 |
| Platinum Sputtering Target | 2871 | 99.9%-99.999% | 7440-06-4 |
| Palladium Sputtering Target | 2802 | 99.9%-99.999% | 7440-05-3 |
| Osmium Ruthenium Sputtering Target | 2793 | 99.99% | |
| Silver Chloride Sputtering Target | 3222 | 99.99% | 7783-90-6 |
References
- D. P. Adams, Thin Solid Films, 576, 98 (2015)
- J. T. Gudmundsson, Plasma Sources Sci.Tech., 29, 113001(2020)
- J. Meyer, Jens; S. Hamwi; M. Kroeger; W. Kowalsky; T. Riedl; A. Kahn, Adv. Mat., 24, 5408 (2012)
- Y-S Rim, J. Inf. Displ., 21, 203 (2020)